热门产品
◆特性 / Features
无卤 Tg：150±5℃, Halogen-freeTg：150±5℃
DicyCure,优秀的剥离强度 Dicy Cure,Excellentpeelstrength
优异耐热性 Td=358℃ T288=30min ExcellentthermalresistanceTd=358℃ T288=30min
低Z 轴热膨胀系数 LowZ-CTE 3.5%
◆应用领域 / Applications
手机、电脑、通讯设备、仪器仪表、摄像机、电视机等。 Mobilephone,Computer,Communicationequipment,Instrumentation,VCR,Television,etc.
◆主要特性 / General properties
|
检测项目 |
单位 |
检测条件 |
规范值 |
典型值 |
|
|
玻璃化转变温度Tg |
℃ |
DSC |
150±5 |
150.2 |
|
|
剥离强度 |
N/mm |
288℃,10S |
≥1.05 |
1.52 |
|
|
热应力 |
S |
288℃,solderdip |
＞10 |
180s |
|
|
弯曲强度 FlexuralStrength |
N/mm2 |
经向LW |
≥415 |
580 |
|
|
纬向 CW |
≥345 |
475 |
|||
|
燃烧性 Flammability |
－ |
E24/125 |
UL94V-0 |
V-0 |
|
|
表面电阻 SurfaceResistivity |
MΩ |
Aftermoisture |
≥1.0×104 |
5.20×107 |
|
|
体积电阻 |
MΩ·cm |
Aftermoisture |
≥1.0×106 |
5.10×108 |
|
|
介电常数 |
－ |
1MHZ |
≤5.4 |
4.6 |
|
|
介质损耗角正切 |
－ |
1MHZ |
≤0.035 |
0.015 |
|
|
耐电弧 ArcResistance |
S |
D48/50＋D0.5/23 |
≥60 |
120 |
|
|
击穿电压 |
KV |
D48/50＋D0.5/23 |
≥40 |
57 |
|
|
吸水率 |
% |
D24/23 |
≤0.35 |
0.16 |
|
|
热分解温度 Td |
℃ |
Weight Loss5% |
≥325 |
358 |
|
|
T288（不覆铜） |
min |
TMA |
≥5 |
30 |
|
|
Z-CTE/50-260 ℃ |
% |
TMA |
≤4.0 |
3.5 |
|
|
卤素含量Halogen content |
Cl |
ppm |
EDX-GP |
≤900 |
300 |
|
Br |
ppm |
≤900 |
30 |
||
|
Cl+Br |
ppm |
≤1500 |
330 |
||
|
相比漏电起痕指数 CTI |
V |
IEC-60112 |
175~250 |
200 |
|
|
≥600 |
600 |
||||
SpecimenThickness:1.6mm ; Specificationsheet：IPC-4101C/127，isforyour referenceonly
Explanation:C:Humidityconditioning;D: Immersionconditioningindistilledwater;
E:Temperatureconditioning;
◆产品系列 / Purchasinginformation
|
厚度Thickness |
铜箔Copper foil |
标准尺寸 |
|
0.10~3.2mm |
12um~105um |
37"×49"、41"×49"、43"×49" |
※Other sheet sizeandthicknesscouldbe available uponrequest