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◆特性 / Features
Tg≥150℃ (DSC)
UVBlocking 与 AOI 兼容可提高 PCB 生产效率
UVBlockingandAOI compatible,soastoincreaseproductivity efficiency
优异的耐热性,Td≥325℃,T288≥5min ,适合于无铅焊工艺;
High thermal performance,Td ≥325℃ ,T288≥5min,suitableforlead-freeprocess。
◆应用领域 / Applications
计算机及外围设备、通讯设备、汽车电子。
computer,communicationequipment,Automotiveelectronics.
◆主要特性 / General properties
检测项目 |
单位 |
检测条件 |
规范值 |
典型值 |
|
玻璃化转变温度Tg |
℃ |
DSC |
≥150 |
155.5 |
|
剥离强度 |
N/mm |
288℃,10S |
≥1.05 |
1.41 |
|
热应力 |
S |
288℃,solderdip |
>10 |
120s |
|
弯曲强度 FlexuralStrength |
N/mm2 |
经向LW |
≥415 |
570 |
|
纬向 CW |
≥345 |
465 |
|||
燃烧性 Flammability |
- |
E24/125 |
UL94V-0 |
V-0 |
|
表面电阻 SurfaceResistivity |
MΩ |
Aftermoisture |
≥1.0×104 |
6.10×107 |
|
体积电阻 |
MΩ·cm |
Aftermoisture |
≥1.0×106 |
6.25×108 |
|
介电常数 |
- |
1MHZ |
≤5.4 |
4.7 |
|
介质损耗角正切 |
- |
1MHZ |
≤0.035 |
0.016 |
|
耐电弧 ArcResistance |
S |
D48/50+D0.5/23 |
≥60 |
125 |
|
击穿电压 |
KV |
D48/50+D0.5/23 |
≥40 |
57 |
|
吸水率 |
% |
D24/23 |
≤0.35 |
0.10 |
|
热分解温度 Td |
℃ |
Weight Loss5% |
≥325 |
348 |
|
CTE Z-axis |
Alpha1 |
ppm / ℃ |
TMA |
≤60 |
55 |
Alpha 2 |
ppm / ℃ |
≤300 |
275 |
||
50-260 ℃ |
% |
≤3.5 |
3.3 |
||
T288 |
min |
TMA |
≥5 |
20 |
|
相比漏电起痕指数 CTI |
V |
IEC-60112 |
175~250 |
200 |
SpecimenThickness:1.6mm ; Specificationsheet:IPC-4101C/99,is foryour referenceonly
Explanation:C: Humidityconditioning; D: Immersionconditioningindistilledwater;
E:Temperatureconditioning;
◆优秀的耐热稳定性 / ExcellentThermal Resistancs
前处理:125℃烘烤 2 小时 /Pre-Treatment: 125℃/2hourintheoven
循环条件:-40℃(30min)~+125℃(30min),转换时间<2min
Thermal shockcondition:-40℃(30min)~+125℃(30min),transfertime<2min
◆优秀的耐 CAF 稳定性 / ExcelentAnti-CAFPerformance
测试条件:孔心距:0.65mm, 孔径:0.3mm, DC50V/85℃/85%RH
Specimen:Backset:0.65mm,Aperture:0.3mm,DC50V/85℃/85%RH
◆产品系列 / Purchasinginformation
厚度Thickness |
铜箔Copper foil |
标准尺寸 |
0.10~3.2mm |
12um~105um |
37"×49"、41"×49"、43"×49" |
※Other sheet sizeandthicknesscouldbe available uponrequest